8456 Machine Tools for Working any Material by Removal of Material, by Laser or Other Light or Photon Beam, Ultrasonic, Electro-discharge, Electro-chemical, Electron Beam, Ionic-beam or Plasma arc Processes, Water-jet Cutting Machines (Excl. Cleaning ApparatuS Operated by Ultrasonic Processes, Soldering and Welding Machines, Incl. Those Which can be Used for Cutting, and Material Testing Machines)

8456 (01/1988-..) Machine Tools for Working any Material by Removal of Material, by Laser or Other Light or Photon Beam, Ultrasonic, Electro-discharge, Electro-chemical, Electron Beam, Ionic-beam or Plasma arc Processes, Water-jet Cutting Machines (Excl. Cleaning ApparatuS Operated by Ultrasonic Processes, Soldering and Welding Machines, Incl. Those Which can be Used for Cutting, and Material Testing Machines) 84561000 (01/2007-12/2016) Machine Tools for Working any Material by Removal of Material, Operated by Laser or Other Light or Photon Beam Processes (Excl. Soldering and Welding Machines, Incl. Those Which can be Used for Cutting, Material Testing Machines and Machines for the ManuFacture of Semiconductor Devices or of Electronic Integrated Circuits) 84561010 (01/1998-12/2006) Machine Tools for Working any Material by Removal of Material, Operated by Laser or Other Light or Photon Beam Processes, of a Kind Used in the Manufacture of Semiconductor Wafers or Devices 84561090 (01/1998-12/2006) Machine Tools for Working any Material by Removal of Material, Operated by Laser or Other Light or Photon Beam Processes (Excl. Those of a Kind Used in the Manufacture of Semiconductor Wafers or Devices, Soldering and Welding Machines, Incl. Those WhichCan be Used for Cutting, and Material Testing Machines) 84561110 (01/2017-..) Machine Tools for Working any Material by Removal of Material, Operated by Laser, of a Kind Used Solely or Principally for the Manufacture of Printed Circuits, Printed Circuit Assemblies, Parts of Heading 8517, or Parts of Automatic Data Processing MachiNes 84561190 (01/2017-..) Machine Tools for Working any Material by Removal of Material, Operated by Laser (Excl. Soldering and Welding Machines, Also Those Which can be Used for Cutting, Material Testing Machines and Machines for the Manufacture of Semiconductor Devices, ElectroNic Integrated Circuits, Printed Circuits, and Parts of Heading 8517 or of Computers) 84561210 (01/2017-..) Machine Tools for Working any Material by Removal of Material, Operated by Light or Photon Beam Processes Other Than Laser, of a Kind Used Solely or Principally for the Manufacture of Printed Circuits, Printed Circuit Assemblies, Parts of Heading 8517, OR Parts of Automatic Data Processing Machines 84561290 (01/2017-..) Machine Tools for Working any Material by Removal of Material, Operated by Light or Photon Beam Processes Other Than Laser (Excl. Soldering and Welding Machines, Also Those Which can be Used for Cutting, Material Testing Machines and Machines for the ManUfacture of Semiconductor Devices, Electronic Integrated Circuits, Printed Circuits, and Parts of Heading 8517 or of Computers) 84562000 (01/2007-..) Machine Tools for Working any Material by Removal of Material, Operated by Ultrasonic Processes (Excl. Cleaning Apparatus Operated by Ultrasonic Processes and Material Testing Machines) 84563000 (01/1988-12/1993) Machine-tools Operated by Electro-discharge Processes 84563011 (01/1994-..) Machine Tools for Working any Material by Removal of Material, Operated by Electro-discharge Processes, Wire-cut, Numerically Controlled 84563019 (01/1994-..) Machine Tools for Working any Material by Removal of Material, Operated by Electro-discharge Processes, Numerically Controlled (Excl. Such Machines, Wire-cut) 84563090 (01/1994-..) Machine Tools for Working any Material by Removal of Material, Operated by Electro-discharge Processes, not Numerically Controlled 84564000 (01/2017-..) Machine Tools for Working any Material by Removal of Material, Operated by Plasma arc Processes 84565000 (01/2017-..) Water-jet Cutting Machines 84569000 (01/2017-..) Machine Tools for Working any Material by Removal of Material, Operated by Electro-chemical, Electron Beam or Ionic-beam Processes (Excl. Soldering and Welding Machines, Material Testing Machines and Machines for the Manufacture of Semiconductor DevicesOr of Electronic Integrated Circuits) 84569010 (01/1995-12/1995) Focused ion Beam Milling Machines for Producing or Repairing Masks and Reticles for Patterns on Semiconductor Devices 84569020 (01/2012-12/2016) Water-jet Cutting Machines 84569030 (01/1995-12/1995) Machine Tools for dry Etching, Stripping or Cleaning Semiconductor Wafers 84569080 (01/2012-12/2016) Machine Tools for Working any Material by Removal of Material, Operated by Electro-chemical Processes or Electron Beam, ion Beam or Plasma arc Processes (Excl. for Soldering and Welding Machines, Materials Testing Machines and Machines for the ManufacturE of Semiconductor Devices or of Electronic Integrated Circuits) 84569090 (01/1995-12/1995) Machine Tools for Working any Material by Removal of any Material by Electro-chemical Processes or Electron Beam, ion Beam or Plasma arc Processes (Excl. for Soldering and Welding Machines, Materials Testing Machines, Focused ion Beam Milling Machines FoR Producing or Repairing Masks and Reticles for Patterns on Semiconductor Devices, and Machine Tools for dry Etching, Stripping or Cleaning Semiconductor Wafers) 84569100 (01/1996-12/2006) Apparatus for Dry-etching Patterns on Semiconductor Materials 84569910 (01/1996-12/2006) Focused ion Beam Milling Machines for Producing or Repairing Masks and Reticles for Patterns on Semiconductor Devices 84569930 (01/1996-12/2006) Machine Tools for Stripping or Cleaning Semiconductor Wafers by Electro-chemical Processes or Electron Beam, ion Beam or Plasma arc Processes 84569950 (01/1998-12/2006) Machine Tools for Dry-etching Patterns on lcd Substrates by Electro-chemical Processes or Electron Beam, ion Beam or Plasma arc Processes 84569980 (01/1998-12/2006) Machine Tools for Working any Material by Removal of Material, Operated by Electro-chemical Processes or Electron Beam, ion Beam or Plasma arc Processes (Excl. for Soldering and Welding Machines, Materials Testing Machines, Focused ion Beam Milling MachiNes for Producing or Repairing Masks and Reticles for Patterns on Semiconductor Devices, Machine Tools for Dry-etching Patterns on Semiconductor Materials and on lcd Substrates, and Apparatus for Stripping or Cleaning Semiconductor Wafers) 84569990 (01/1996-12/1997) Machine-tools for Working any Material by Removal of any Material by Electro-chemical Processes or Electron Beam, ion Beam or Plasma arc Processes (Excl. for Soldering and Welding Machines, Materials Testing Machines, Focused ion Beam Milling Machines FoR Producing or Repairing Masks and Reticles for Patterns on Semiconductor Devices, Machine-tools for Dry- Etching Patterns on Semi-conductor Materials and Apparatus for Stripping or Cleaning Semiconductor Wafers)